The DIS8000 is primarily designed to handle frame wafers after the wafer dicing process. The system is capable of handling 8" size wafers with frames/rings and 12" size wafers with frames/rings. Wafer inspection is performed after the wafer dicing process to check for observable defects prior to dicing and mold defects generated after the dicing process. In general, most incoming wafers have two types of defect identification methods; inkjet marking on defective die and wafer mapping systems that include defect die location and classification.
DIS8000 The second optical detection system
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Single wafer autoloader for 8" and 12" wafer sizes
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One load port for standard open cassette
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High power microscope equipped with five objectives (range 2.5x to 50x)_d04a07d8-9cd1-3239-9149-20813d6c 673b_
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XY moving electric stage
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Decode customer wafer mapping to QMC mapping system
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Image Acquisition System
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User Defined Rejection Code and Post Inspection Summary Lot Report
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Built-in barcode scanner for downloading/uploading wafer map from server
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