The WPS3200 is designed to handle the packing and unpacking process of 6" and 8" wafers in various types of shipping carriers. The system is equipped with a wafer pre-aligner for wafer positioning and orientation, and a wafer ID reader for OCR and 2D matrix code reading. In addition, the WPS3200 is equipped with a built-in vision sensor for wafer, liner or ring spacer detection, and a built-in height sensor for robot handling precision. Mapping sensors are integrated into the robotic arm to detect any wafer cross slots and dual wafers during operation.
WPS3200 Wafer Packaging and Unpacking System
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2 Open Cassette Base Stations with Integrated Wafer Protrusion Detection Sensors (6" and 8" Common)
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2 wafer tank stations (can be configured as 1 wafer bucket and 1 wafer tank, optional Cartesian robot module)
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1 backing paper port (automatic conversion between 6" and 8")
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Hirata 4-axis robotic arm with wafer flipping function
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Built-in color sensors for wafer, liner, or ring spacer detection, and built-in height sensors for robotic handling precision on cassette and pod load ports, (1 on the "Separator Cassette" port height sensor.)
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Cartesian robot module for wafer pot handling (optional)
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Wafer Ring Separator Handling Module for Cassettes (Optional)
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