The laser-based wafer thickness and roughness measurement system is developed by Chapman Instrument Inc. and by QES Mechatronic Technology Co., Ltd. Bhd.) OEM production. Non-contact measurement system to measure multiple parameters in a single system (wafer and tape thickness, roughness, total thickness variation (TTV), bump height, bow and warpage measurement)
MPT1000 Wafer Thickness and Roughness Measurement System
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Thickness resolution is 0.1μm, providing uniform TTV for wafer production control.
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Measuring after back grinding or dicing provides flexibility for thickness uniformity control.
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The small focused laser spot (1µm) provides the resolution needed to measure bumped wafer and via features.
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