The DIS8000 is primarily designed to handle frame wafers after the wafer dicing process. The system is capable of handling 8" size wafers with frames/rings and 12" size wafers with frames/rings. Wafer inspection is performed after the wafer dicing process to check for observable defects prior to dicing and mold defects generated after the dicing process. In general, most incoming wafers have two types of defect identification methods; inkjet marking on defective die and wafer mapping systems that include defect die location and classification. ​