The WPS3200 is designed to handle the packing and unpacking process of 6" and 8" wafers in various types of shipping carriers. The system is equipped with a wafer pre-aligner for wafer positioning and orientation, and a wafer ID reader for OCR and 2D matrix code reading. In addition, the WPS3200 is equipped with a built-in vision sensor for wafer, liner or ring spacer detection, and a built-in height sensor for robot handling precision. Mapping sensors are integrated into the robotic arm to detect any wafer cross slots and dual wafers during operation.
